Three New Multi-Chip Modules Offer Industry-Leading Power Efficiency

GREENSBORO, NC – June 6, 2016 – Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, today unveiled three new DOCSIS 3.1-ready power doubler multi-chip modules (MCMs). Qorvo’s newest power doubler MCM amplifiers provide cable broadband service providers an easy upgrade path to DOCSIS 3.1 with maximum design flexibility and functionality while conserving power and reducing board space.

Kellie Chong, director, CATV and Broadband Access products for Qorvo said, "Our latest power doubler MCMs give our customers additional tools to reach more subscribers with greater bandwidth and higher output power. Additionally, the compact MCM packaging provides a cost effective solution, saving up to 70% board space compared to traditional hybrid packages."

The MCMs feature temperature-sensing pins to ease assembly, reduce power consumption and provide added confidence during printed circuit board reflow. A combination of DC power adjust and current adjust capability allows operators to manage networks intelligently and reduce power consumption without sacrificing performance.

The RFCM3327 and RFCM3328 feature Qorvo's market-leading GaN on SiC process to deliver superior thermal conductivity. The RFCM3327 offers 23 dB gain, while the RFCM3328 offers 25 dB gain. Both power doublers are capable of +63 dBmV power output, the highest performance of their class, and both include an external current control feature that allows customers to reduce overall power consumption by up to 20% while meeting required linearity specifications.

The QPB8808 is notable for its compact footprint, which saves up to 70% printed circuit board space over competing solutions. The 12V amplifier operates from 45 MHz to 1218 MHz, offers 20.5 dB gain and +58 dBmv power output, and includes a variable current bias adjust feature to conserve power while maintaining high output.

Qorvo leads CATV GAN RF with more that 50% market share* and offers more than 60 DOCSIS 3.1-ready components, including attenuators, switches, power doubler amplifiers, pre-driver gain blocks, push-pull amplifiers and reverse path amplifiers. Qorvo uses highly differentiated, internally developed process technologies, including GaN high-electron-mobility transistor (HEMT), to deliver superior linearity, output power and reliability. Qorvo's reverse path amplifiers operate from up 300MHz – well beyond the current requirement of 204MHz for existing return path amplifiers.

Qorvo will feature its DOCSIS 3.1 portfolio at the upcoming ANGA COM 2016 European Exposition and Congress, in Cologne, Germany, June 7-9, 2016 at booth 10.2 / L36.

About Qorvo

Qorvo (NASDAQ: QRVO) makes a better world possible by providing innovative RF solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including advanced wireless devices, wired and wireless networks and defense radar and communications. We also leverage our unique competitive strengths to advance 5G networks, cloud computing, the Internet of Things, and other emerging applications that expand the global framework interconnecting people, places and things. Visit www.qorvo.com to learn how Qorvo connects the world.

* Yole Développement, 2016

Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries.

Investor Relations Contact: Doug DeLieto VP, Investor Relations +1-336-678-7088

Media Contact: Katie Caballero Marketing Communications Manager Qorvo Infrastructure and Defense Products katie.caballero@qorvo.com +1-972-994-8546

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