TGA2533-SM_EVB.dwg Autocad layer naming convention: 	
(units: mm)	
Top Copper Layer:	TopMetal
Bottom Copper Layer:	BottomMetal
Top Soldermask Layer:	SolderMaskTop
Top Silkscreen Printing:Ink
Drill Holes: DrillHoles 

TGA2533-SM Gerber Layer File name conventions:		 
Top Copper Layer:	*TopMetal.gbr
Bottom Copper Layer:	*BottomMetal.gbr
Top Soldermask Layer:	*SolderMaskTop.gbr
Top Silkscreen Printing:*Ink.gbr
Drill Holes: *DrillHoles.gbr 


TGA2533-SM_EVB Board Specifications: 	
1. 1 insulating layers - Rogers RO4003 (er = 3.38) 8mils thick. 	
2. Top metal (TopMetal): 1 oz copper layers with patterning on layer
3. Bottom metal (BottomMetal): plated with 1oz copper through out the bottom of PCB
4. Plating: Immersion gold suitable for lead free soldering top and bottom copper layers	
5. Topside soldermask layer (SolderMaskTop) - Color: Blue
6. Topside silkscreen layer (Ink) - Color:  White	
7. Boards to be arrayed in a panel for scribe and break.	
8. All drill holes (DillHoles) < 60mil diameter PTH (plated through holes).	
9. All drill holes (DrillHoles) > 60mil diameter may be either  PTH (plated through holes) or NPT (non plated through holes).	
	
	

	

	



		

	







	

	
	

	

	


	

