QPA2609D EVB PCB used the same design of QPA2628D

Fabrication Notes for QPA2628D PCB
1.	BOARD FABRICATION METHODS MUST COMPLY WITH:
	FABRICATE IN ACCORDANCE WITH IPC-6018B, per IPC-6011, CLASS 2.

2.	ARTWORK FORMAT:        GERBER 274X
 	GERBER DATA SUPPLIED WITH DESIRED FINAL TRACE WIDTHS. PROCESS
 	COMPENSATION TRACE WIDTH ADJUSTMENTS TO BE DONE BY PCB FABRICATOR

3.	MATERIAL:
	NUMBER OF LAYERS: 2 LAYERS
	METAL 1	(TOP):   0.5oz.
	CORE 1:		ROGERS 4003C, .008in. THICK 
	METAL 2	(BOTTOM):       0.5oz.
	SOLDERMASK TOP: LPI (LIQUID PHOTO-IMAGEABLE), GREEN OR LDI (LASER DIRECT IMAGEABLE), GREEN. 
	MAX FINISH THICKNESS OF SOLDERMASK TO BE 0.001in.
	SILKSCREEN TOP: HIGH TEMPERATURE, NON-CONDUCTIVE, WHITE EPOXY BASED INK.

4.	FINISH PLATING:
	METAL 1(TOP) AND METAL 2(BOTTOM):
	ENIG (ELECTROLESS NICKEL/IMMERSION GOLD):
	NICKEL PLATE per IPC-4552, 118 - 236in. (3 - 6m)
	IMMERSION GOLD (10uin) IAW IPC-4552, CLASS 3

5.	FINISHED BOARD THICKNESS:  (0.013in.)

6.	COPPER IS PULLED BACK 0.002in. FROM EDGE OF BOARD ON METAL 1 (TOP) AND METAL 2 (BOTTOM).

7.	TOLERANCE: PC BOARD OUTLINE: 0.002in.

8.	BURRS SHALL NOT EXCEED 0.002in.

9.	VIA PLATING/FILLING:
   	A. ALL VIAS UNDER THE DUT ARE TO BE:
      	EPOXY-FILLED, (CB100 OR TATSUTA 8E3030) CONDUCTIVE EPOXY, PLANARIZED.
10. 	ALL OTHER PLATED THRU HOLES TO BE PLATED TO 0.0014in. MIN. THICKNESS.

11.	METAL 1(TOP) AND METAL2(BOTTOM) AFTER OVERPLATING AND PLANARIZATION SHALL HAVE A MAX 
	ALLOWABLE NEGATIVE FEATURE OF 0.0008in. AND A MAX ALLOWABLE POSITIVE FEATURE OF 0.0003in.

12.	CONDUCTOR WIDTHS AND SPACING TO BE WITHIN 0.001in. OF CAD DATABASE.

13.	SOLDERMASK IN PLATED-THRU HOLES IS ACCEPTABLE AS LONG AS IT DOES NOT EXIST ON BACKSIDE OF BOARD.

14.	ALL HOLES TO BE LOCATED WITHIN 0.003 OF CAD DATABASE.

	