QPC6324
Absorptive, High Isolation SPDT Switch
Key Features
- 5 MHz to 6000 MHz Operation
- Non-Reflective (RFX ports)
- Terminated All-OFF State mode
- No Blocking Caps needed unless voltage is on RF Line
- High Isolation:
-
RFC-RFX: 62 dB at 2 GHz
-
RFX-RFX: 63 dB at 2 GHz
- +1.8 V Logic compatible
- HBM ESD rating: Class 2 (2000V to <4000V)
| Mouser | 10172 | Buy Online > | |
| RELL | 1015 | Buy Online > | |
| RFMW | 359 | Buy Online > |
The QPC6324 is a Silicon on Insulator (SOI) single-pole, double-throw (SPDT) switch, designed for use in 4G/5G wireless infrastructure applications and other high performance communications systems. It offers high isolation with excellent linearity and power handling capability. No blocking capacitors are necessary on the RF ports. The design is non-reflective such that the RFX ports are terminated into 50 ohm in the off state. The QPC6324 is +1.8V logic compatible.
The QPC6324 is packaged in a RoHS-compliant, compact 4x4 mm surface-mount leadless package.
Typical Applications
- Wireless Infrastructure
- Macro or Pico-cell Basestations
- TDD-based Architectures
Product Categories
Application Categories
| Switch Type | SPDT |
| Absorptive/Reflective | Absorptive |
| Frequency Min(MHz) | 5 |
| Frequency Max(MHz) | 6,000 |
| Insertion Loss(dB) | 0.9 |
| Isolation(dB) | 62 |
| Switching Speed(ns) | 150 |
| IIP3(dBm) | 60 |
| Control Lines(#) | 2 |
| Voltage(V) | 5 |
| Current(mA) | 0.1 |
| Package Type | SMT |
| Package(mm) | 4 x 4 |
| RoHS | Yes |
| Lead Free | Yes |
| Halogen Free | Yes |
| ITAR Restricted | No |
X-Microwave Design System
This product is available as an X-Microwave Block (X-MWblock) for evaluation.
X-MWblocks are RF and microwave "drop-in" components that can be used individually for prototyping or in production assemblies. X-MWblocks are easy to test, integrate, align, and configure to 60 GHz and beyond. No messy sweat soldering or silver epoxy processes are required. X-MWblocks are highly characterized with S-parameter models and connect with a patented solder-less interconnect technology.
This product appears in the following application block diagrams: