TQPHT09 90 nm pHEMT Ideal for Next-Generation High Frequency Amplifiers

Greensboro, N.C. and Los Angeles, Calif – March 26, 2015 – Qorvo, Inc. (Nasdaq: QRVO), a leading provider of RF solutions for mobile, infrastructure and aerospace/defense applications, today announced a new gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT) process technology that provides higher gain/bandwidth and lower power consumption than competing semiconductor processes. Qorvo™'s new TQPHT09 is a 90 nm pHEMT process that supports Qorvo's next-generation optical product portfolio. Coupled with Qorvo's industry-leading reliability, this new process is ideal for next-generation high frequency, high performance amplifiers required for 100G+ linear applications.

Manufactured in Qorvo's industry leading GaAs fabrication facility in Richardson, Texas, TQPHT09 is the newest offering in the Company's well-established pHEMT process portfolio. Qorvo's TQPHT09 serves as the basis for several new optical modulator driver products including the TGA4960-SL, the Company's most advanced quad-channel 100G modulator driver. The TGA4960-SL is available in the CFP2 form factor for Metro and long haul applications, and is also well suited for upgrading the 100G linear dual-channel drivers for line card applications. It is optimized for high performance, low power dissipation and high channel-to-channel isolation, and is packaged in a 14.0 x 8.0 x 2.6 mm SMT module, the smallest footprint in the industry.

James Klein, president of Qorvo's Infrastructure and Defense Products group, said, "Qorvo continues to invest and develop the most competitive semiconductor process technologies in the industry, enabling best-in-class components for next-generation products. Qorvo's new 90 nm pHEMT process exemplifies our leadership in providing components for high-speed market applications with the quality, reliability and dependable source of supply our customers expect."

Qorvo is showcasing its expanding portfolio of flexible and agile solutions for optical applications at the Optical Fiber Communication Conference and Exposition (#OFC) in Los Angeles, California, March 24-26 at Booth 1433. To learn more about TQPHT90 process advantages, TGA4960-SL and other high-performance driver modules and TIAs for 100G+ applications, visit www.qorvo.com/optical.

About Qorvo

Qorvo (Nasdaq:QRVO) is a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications. Qorvo was formed following the merger of RFMD and TriQuint, and has more than 6,000 global employees dedicated to delivering solutions for everything that connects the world. Qorvo has the industry's broadest portfolio of products and core technologies; world-class ISO9001-, ISO 14001- and ISO/TS 16949-certified manufacturing facilities; and is a DoD-accredited 'Trusted Source' (Category 1A) for GaAs, GaN and BAW products and services. For the industry's leading core RF solutions, visit www.qorvo.com.

Qorvo Media Contact

Katie Caballero
Marketing Communications Manager
Qorvo Infrastructure and Defense Products
+1-972-994-8546
katie.caballero@qorvo.com

This press release includes "forward-looking statements" within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, but are not limited to, statements about our plans, objectives, representations and contentions, and are not historical facts and typically are identified by use of terms such as "may," "will," "should," "could," "expect," "plan," "anticipate," "believe," "estimate," "predict," "potential," "continue" and similar words, although some forward-looking statements are expressed differently. You should be aware that the forward-looking statements included herein represent management's current judgment and expectations, but our actual results, events and performance could differ materially from those expressed or implied by forward-looking statements. We do not intend to update any of these forward-looking statements or publicly announce the results of any revisions to these forward-looking statements, other than as is required under the federal securities laws. Qorvo's business is subject to numerous risks and uncertainties, including variability in operating results, the inability of certain of our customers or suppliers to access their traditional sources of credit, our industry's rapidly changing technology, our dependence on a few large customers for a substantial portion of our revenue, our ability to implement innovative technologies, our ability to bring new products to market and achieve design wins, the efficient and successful operation of our wafer fabrication facilities, assembly facilities and test and tape and reel facilities, our ability to adjust production capacity in a timely fashion in response to changes in demand for our products, variability in manufacturing yields, industry overcapacity and current macroeconomic conditions, inaccurate product forecasts and corresponding inventory and manufacturing costs, dependence on third parties and our ability to manage channel partners and customer relationships, lawsuits and claims relating to our products, security breaches and other similar disruptions compromising our information and exposing us to liability, and our ability to integrate the businesses of RFMD and TriQuint. These and other risks and uncertainties, which are described in more detail in Qorvo's filings with the Securities and Exchange Commission, could cause actual results and developments to be materially different from those expressed or implied by any of these forward-looking statements.