Headquarters: China

    Region(s) Served: APAC

    Goermicro is a semiconductor company mainly engaged in the research and development, production and sales of MEMS devices and SiP microsystem modules. Goermicro is capable of providing customers with one-stop product solutions of "chip + device + module". The company's main products include MEMS sensors and SiP modules, which are widely used in consumer electronics fields such as smart phones, smart wireless headsets, tablet computers, smart wearable devices and smart homes, as well as automotive electronics and other fields.

    Goermicro is headquartered in Qingdao, with Qingdao, Weifang and Rongcheng as production bases, and Qingdao, Weifang, Beijing, Shanghai, Shenzhen, Wuxi, the United States and other places as R&D and business development centers.

    The company's core R&D engineers have profound professional academic background, long-term industry experience and technical understanding, and have high technical level and research and development capabilities. A number of technological breakthroughs have been achieved in the fields of modules and other fields and fruitful research and development achievements have been accumulated.

    Goermicro has the ability to provide integrated services from product design to packaging and testing. After extensive research in the early stage, in response to different market demands, Goermicro has launched two ultra-small UWB SiP modules for the first time: " GSUB-0001" UWB module, and "GSUB-0002" low power system module with integrated BLE chip.

    Products

    GSUB-0001

    Product features:

    • UWB SiP module, integrated UWB, filters and other major components, ultra-small LGA package, low power consumption
    • Module & EVB & algorithm development kit helps customers develop products faster and achieve centimeter-level precise locating

    Target application fields:

    • Smart factory, label, smart wear, smart retail, Internet of things
    GSUB-0001

    GSUB-0002

    Product features:

    • UWB SiP module, integrated UWB, BLE, G-Sensor, filter and other major components, ultra-small LGA package, low power consumption
    • Module & EVB & algorithm development kit helps customers develop products faster and achieve centimeter-level precise locating

    Target application fields:

    • Smart wear, smart home, Internet of things
    GSUB-0002

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