Qorvo® RF Fusion22™ Wins Prestigious 2023 GTI Award
Greensboro, NC, March 28, 2023 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, announced that its RF Fusion22™ chipset has won the 2023 GTI Innovative Breakthrough in Mobile Technology Award. The award recognizes Qorvo's technical innovation in 5G chipsets, which combine compact, high-performance 5G functionality for leading smartphone manufacturers. This is the third time Qorvo's 5G offerings have been recognized with the GTI Award.
The Global TD-LTE Initiative (GTI) is an open global association of operators and vendors dedicated to promoting the development of TD-LTE and 5G. The GTI Awards program recognizes the most outstanding achievements and success in the industry and encourages the development of innovative products, services and applications. Qorvo previously won GTI's Innovative Breakthrough in Mobile Technology Awards in 2020 for its RF Fusion™ 5G chipset and in 2018 for its 5G RF Front End (RFFE).
"We are honored to be recognized again with the prestigious GTI Award," said Frank Stewart, president of Qorvo's Advanced Cellular business. “This award underscores Qorvo's commitment to technology and product leadership in 5G RF front ends. We are proud to offer designers an outstanding solution that fits their new 5G smartphone designs."
Qorvo's Fusion22 solution enables next-generation, high-performance functionality to support the continued expansion of 5G into all tiers of the mobile device market. The chipset draws from industry leading technologies (BAW, SOI, GaAs HBT) and deep experience in radio architecture to provide a high-performance solution for the next generation of 5G handsets. Each module is optimized and tested as a complete reference design, enabling manufacturers to leverage pre-validated interoperability and high levels of integration to minimize engineering effort and lower design risk.
| Part Number | Description |
| QM77058X | Family of MHB, integrated LNA, PA modules with integrated duplexers (L-PAMiD) |
| QM77055 / 77052 | Low-band L-PAMiD |
| QM78212 | Ultra-high band PA module with LNA and integrated filters (L-PAMiF) |
Learn more about Qorvo's RF Fusion solutions here.
Qorvo's high-performance RF solutions simplify design, reduce product footprint, conserve power, improve system performance and accelerate the adoption of carrier aggregation. Qorvo combines systems-level expertise, broad manufacturing scale, and the industry's most comprehensive product and technology portfolio to help leading manufacturers deliver the next generation of LTE, LTE-A, 5G and IoT products. Qorvo's core RF solutions set the standard for next-gen connectivity, with unmatched integration and performance at the heart of the connected world.
About Qorvo
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.
Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries. All other trademarks are the property of their respective owners.
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