GREENSBORO, NC and HILLSBORO, OR – October 6, 2015 – Qorvo™, Inc. (NASDAQ: QRVO), a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, today announced a series of innovations intended to accelerate the deployment of high-speed cable TV (CATV) DOCSIS 3.1 networks while providing cable designers greater flexibility in product design. Qorvo's newest multi-chip module packaging, thermal sensing pins, and advanced gallium nitride on silicon carbide (GaN on SiC) integration capabilities enable CATV product designers to lower costs, increase bandwidth, and reduce board space.


    Qorvo's multi-chip-module (MCM) packaging
    helps customers reduce board space by up to
    50 percent versus traditional SOT115J packaging.

    Qorvo's multi-chip-module (MCM) packaging helps customers reduce board space by up to 50 percent and enables up to 30 percent cost savings versus traditional SOT115J packaging. Qorvo's MCM packaging includes temperature-sensing pins, which ensure proper assembly and provide optimal thermal management. To facilitate the use of its newest advanced MCM capabilities, Qorvo offers customers PCB layout and thermal design support services.

    Multi-system operators (MSOs) can leverage the market leading output and gain performance of Qorvo's GaN on SiC technology to upgrade equipment within existing product footprints, saving installation time and cost while enhancing performance. Additionally, Qorvo's GaN on SiC technology helps reduce overall power consumption by up to 20 percent with associated features such as adjustable current control.

    Kellie Chong, director, CATV and Broadband Access products for Qorvo, said, "Qorvo is leveraging our broad portfolio of advanced packaging and process technologies to help leading CATV customers lower costs, increase bandwidth, and achieve significant board space savings. Qorvo has shipped more than two million CATV GaN amplifiers and is the industry-leading GaN supplier for the cable market. We are pleased to offer customers the benefits of our newest innovations to accelerate the deployment of their DOCSIS 3.1 networks."

    Qorvo's newest DOCSIS 3.1 products include the RFCM3316 and RFCM3326 GaN-based power doubler amplifiers and are available in miniaturized 9mm x 8mm MCM packaging.

    About Qorvo's DOCSIS 3.1 Products

    Qorvo's DOCSIS 3.1 forward path amplifiers operate from 45MHz to 1.2GHz with very high output (capable of 74dBmV composite power), extremely low distortion (lower than 70dBc), and excellent input and output return loss (-20dB typical). Qorvo's reverse path amplifiers operate up to 300MHz with integrated attenuator and power down function.

    Qorvo's DOCSIS 3.1 products are available in multi-chip module (MCM), SOT-115J, and standard monolithic microwave integrated circuit (MMIC) packages, including QFN, SOT89, and SOIC. Qorvo's MMIC products include gain amplifiers, low equivalent input noise current (EINC) trans-impedance amplifiers (TIA), attenuators, switches, filters, and complete optical receivers for RF over glass (RFoG) and passive optical network (PON) applications. Qorvo's DOCSIS 3.1 solutions employ the latest high-performance process technologies, including GaN high-electron-mobility transistor (HEMT) technology, which delivers superior linearity, output power and reliability. For more information about Qorvo's line of DOCSIS 3.1 products, download the Qorvo Broadband DOCSIS 3.1 brochure.

    Qorvo will be exhibiting at the SCTE 2015 Cable-Tec Expo in New Orleans, LA, from October 14, 2015, through October 16, 2015.

    About Qorvo

    Qorvo (NASDAQ:QRVO) is a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications. Qorvo was formed following the merger of RFMD and TriQuint, and has more than 6,000 global employees dedicated to delivering solutions for everything that connects the world. Qorvo has the industry's broadest portfolio of products and core technologies; world-class ISO9001-, ISO 14001- and ISO/TS 16949-certified manufacturing facilities; and is a DoD-accredited 'Trusted Source' (Category 1A) for GaAs, GaN and BAW products and services. For the industry's leading core RF solutions, visit

    Qorvo Media Contact

    Katie Caballero
    Marketing Communications Manager
    Qorvo Infrastructure and Defense Products

    This press release includes "forward-looking statements" within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, but are not limited to, statements about our plans, objectives, representations and contentions and are not historical facts and typically are identified by use of terms such as "may," "will," "should," "could," "expect," "plan," "anticipate," "believe," "estimate," "predict," "potential," "continue" and similar words, although some forward-looking statements are expressed differently. You should be aware that the forward-looking statements included herein represent management's current judgment and expectations, but our actual results, events and performance could differ materially from those expressed or implied by forward-looking statements. We do not intend to update any of these forward-looking statements or publicly announce the results of any revisions to these forward-looking statements, other than as is required under the federal securities laws. Qorvo's business is subject to numerous risks and uncertainties, including variability in operating results, the inability of certain of our customers or suppliers to access their traditional sources of credit, our industry's rapidly changing technology, our dependence on a few large customers for a substantial portion of our revenue, our ability to implement innovative technologies, our ability to bring new products to market and achieve design wins, the efficient and successful operation of our wafer fabrication facilities, assembly facilities and test and tape and reel facilities, our ability to adjust production capacity in a timely fashion in response to changes in demand for our products, variability in manufacturing yields, industry overcapacity and current macroeconomic conditions, inaccurate product forecasts and corresponding inventory and manufacturing costs, dependence on third parties and our ability to manage channel partners and customer relationships, our dependence on international sales and operations, our ability to attract and retain skilled personnel and develop leaders, the possibility that future acquisitions may dilute our shareholders' ownership and cause us to incur debt and assume contingent liabilities, fluctuations in the price of our common stock, additional claims of infringement on our intellectual property portfolio, lawsuits and claims relating to our products, security breaches and other similar disruptions compromising our information and exposing us to liability, the impact of stringent environmental regulations, and the impact of the integration of Qorvo. These and other risks and uncertainties, which are described in more detail in Qorvo's 8K and other reports and statements filed with the Securities and Exchange Commission, could cause actual results and developments to be materially different from those expressed or implied by any of these forward-looking statements.