Foundry & Services
One RF Partner from Wafer to Mission
Qorvo Elite360SM Foundry & Services gives customer an edge in RF foundry, wafer and die-prep, advanced packaging and mission-aligned space screening. With U.S.-based execution, proven GaN and GaAs MMIC process technologies, secure supply chain control and decades of mission-critical experience, Qorvo helps aerospace, defense, space and high-reliability programs move from concept to qualified solution with confidence.
Contact UsOur Elite360 Capabilities
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Advanced Packaging High-performance RF packaging and module integration with U.S.-based assembly and test from prototype to production |
GaN & GaAs Foundry Industry-leading Gan and GaAs MMIC process technologies and RF foundry services to accelerate innovation and performance. |
Wafer & Die-Prep Services Precision wafer handling, thinning, dicing and surface preparation to support advanced packaging and reliable performance. |
Space Screening Services Mission-aligned screening and traceability across LEO, MEO and GEO to help ensure mission readiness. |
Advanced Microwave Module Assembly Facility (AMMA)
Qorvo's defense and network communications customers receive comprehensive manufacturing services from our U.S-based Advanced Microwave Module Assembly facility, also known as "AMMA."
Through our in-house facility, we can prototype devices, test manufacturability and ramp to full production with almost any standard or custom package.
AMMA provides a "one-stop shop" for Qorvo's design, manufacturing, assembly and packaging. Located just north of Dallas, Texas, this world-class facility provides advanced, integrated assembly and packaging of RF components within communications, radar and electronic warfare (EW) applications.
Packaging Capabilities
- Highly specialized packaging and integrated assembly in our secure facility
- Single and multi-chip assembly
- Low-cost, high-volume packaging
- Die on Tab (DoT) / standard packaging options
Awards and Accreditations
DMEA Accreditation of Trust Certificate and Scope
Wafer & Die-Prep Services
Our Wafer & Die-Prep Services provide the critical foundation for advanced packaging and module RF performance. We deliver precision handling, thinning, dicing and surface preparation for a wide range of materials and wafer sizes.
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Precision Handling: Advanced equipment and careful handling help protect wafer integrity. |
Thinning: Backside wafer thinning capabilities support advanced packaging requirements. |
Dicing: High-precision dicing for clean, ready-to-assemble dies. |
Surface Preparation: Cleaned and conditioned surfaces support advanced packaging processes. |
Our Technologies
Qorvo was founded on RF innovation. We take pride in being a part of the technology all around us, that connects us every day. Our breakthroughs in the wireless market, network infrastructure and the defense and aerospace industries work to increase product performance, lower costs and roll out next-generation technology.
We pioneer and hone processes from the core — using GaN, GaAs, filter technologies and others — to the packaging that fits perfectly in a mobile device or protects it from harsh environmental conditions. We work in the future — solving problems and creating new capabilities within the Internet of Things. Exciting technology developments are all around us. Learn more about what we're working on.
