DALLAS, TX – August 23, 2018 – Active-Semi Int. Inc. announced today a new member of its PAC55XX family of PAC high-performance motor controllers with the PAC5532 IC. It is supported by an Evaluation Kit (EVK) and accompanying firmware for easy and fast evaluation of advanced motor control solutions.
The new PAC5532 contains the highest-performance MCU found in an integrated motor control and driver product on the market. It contains a 150MHz Arm® Cortex®-M4F MCU with 128kB FLASH, 32kB SRAM and an integrated Floating Point Unit (FPU) with Digital Signal Processor (DSP) instructions for highly efficient implementation of motor control and drive applications. The MCU also contains 4-level code protection, a cache for high-speed FLASH access, ECC for SRAM data and a CRC engine.
The PAC5532 also integrates highly-optimized peripherals specifically designed for 40V to 120V BLDC motor control and drive applications, such as battery-powered garden and power tools, e-bikes, e-skateboards, and other medium voltage applications.
The 160V PAC5532 is optimized for battery-powered BLDC applications from 40V to 120V. Integrated with the high-performance MCU is the power management, gate drivers and signal-conditioning for 3-phase inverter applications. The PAC5532 contains a 160V DC/DC Buck controller and a 5V, 200mA DC/DC Converter. The PAC5532 implements a Total Hibernate Mode™ which manages battery life and system efficiency by reducing quiescent current to just 19µA.
The Application-Specific Power Drivers™ (ASPD) integrate 180V/2A gate drivers for high power applications with 2-level dead-time protection for the external MOSFET-based inverter. The Configurable Analog Front-End™ (CAFE) contains 3 Differential Programmable Gain Amplifiers (PGAs), 4 single-ended PGAs, 10 comparators, buffers and DACs that can be used for signal sampling and filtering for the control applications, minimizing the need for external components.
"The PAC5532 is our 2nd product release for our new family of highly integrated BLDC motor control solutions with increased FLASH memory and an Arm®Cortex®-M4F. It specifically targets the rapidly growing battery powered power and garden tool market, but finds use also in new e-mobility." says David Briggs, Vice-President and General Manager at Active-Semi. "It is encouraging to see all the different applications we can service with compacter and more energy efficient solutions to give our customers a leading edge and faster time to market."
In a small 8mm x 8mm QFN package with all of the integration, the PAC5532 can realize an extremely small BOM and physical design size for compact high-power BLDC battery-powered applications.
The PAC5532EVK extends the PAC family of evaluation kits (EVKs) enabling fast prototyping for various applications including garden tools, telecom fans, battery-powered vehicles, and general-purpose BLDC applications. Along with Active-Semi’s motor control firmware and IP library, the PAC5532 will simplify system development with sensored and sensorless FOC and sensorless trapezoidal motor control applications for high-voltage battery powered applications.
PAC5532 IC and PAC5532EVK1 are available from leading distributors.
Please visit www.qorvo.com/how-to-buy for additional contact and purchasing information.
Qorvo (Nasdaq: QRVO) makes a better world possible by providing innovative Radio Frequency (RF) solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including advanced wireless devices, wired and wireless networks and defense radar and communications. We also leverage unique competitive strengths to advance 5G networks, cloud computing, the Internet of Things, and other emerging applications that expand the global framework interconnecting people, places and things. Visit www.qorvo.com to learn how Qorvo connects the world.
Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries. All other trademarks are the property of their respective owners.