Performance is typical at room temperature.
(1) - OFDM, 200 MHz modulation bandwidth, 64QAM.
1. Thermal resistance determined to the back of a 20 mil Cu-Mo carrier plate with eutectic die attach (85 C)
2. Refer to the following document GaN Device Channel Temperature, Thermal Resistance, and Reliability Estimates
The QPF4006 is a multi-function Gallium Nitride MMIC front-end module targeted for 39GHz phased array 5G base stations and terminals. The device combines a low noise high linearity LNA, a low insertion-loss high-isolation TR switch, and a high-gain high-efficiency multi-stage PA.
The QPF4006 operates from 37 GHz to 40.5 GHz range. The receive path (LNA+TR SW) is designed to provide 18dB of gain and a noise figure less than 4.2dB. The transmit path (PA+SW) provides 23 dB of small signal gain and a saturated output power of 2W.
The compact 4.5 mm x 4.0 mm surface mount package configuration is designed to meet the tight lattice spacing requirements for phased array applications.
The QPF4006 is fabricated on Qorvo’s 0.15um GaN on SiC process. It is housed in an air-cavity laminate package with an embedded copper heat slug. The copper slug, coupled with a low thermal resistance die-attach process, allows the QPF4006 to operate at the extreme case temperatures needed in phased array applications.
|Package Type||Laminate SMP|
|Package(mm)||4.5 x 4.0 x 1.8|